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Defect Inspection

As fine features are more frequently implemented in circuit designs and the electronics industry shifts to lead-free processes, we at Speedline Technologies, recognize that reliable inspection is of critical importance to customers who are interested in detecting or preventing defects. The solder paste print operation is widely recognized as a primary source of defects in surface mount assembly. One approach to increasing the yields associated with the solder paste deposition process is to detect print defects immediately after the print operation and reject defective boards before the placement of electronic components. This enables SMT manufacturers to save time otherwise wasted in the assembly of defective boards and avoids costly rework and/or scrap. Whether or not a defect is reported at any specific site, SPC data can be collected and used to monitor and correct undesirable trends before they become critical to the process.

Over the past decade Speedline Technologies has been committed to developing reliable inspection techniques aimed at catching manufacturing defects as early as possible in the assembly process. Speedline Technologies has had numerous inspection related patents awarded and has published several papers on this topic. For example we have developed a unique technology, BridgeVision, which enables our customers to analyze solder bridge defects in a way that is meaningful to the assembly process. Speedline Technologies has also developed a very clever vision probe that makes it possible to look at the stencil and the circuit board with the same camera and no moving parts. This enables our printers to perform fast and precise alignments as well as inspect both circuit boards and stencils.