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Metrology

Facilities We Offer

Full environment control:
1500 sqft of environmentally controlled environment for a full SMT assembly line. Temperature range 65F -90F with a max ramp rate of 15F/hour and relative humidity of 40%-70% with a max ramp rate of 15%/hour

Complete SMT production line:
The assembly line is composed of : solder paste printer, dispenser (optional), pick and place machine, 3D paste inspection AOI, manual rework station, reflow oven.

Cross section analysis:
Full cross sectional capability ranging from metallurgical sample preparation to cross section analysis.

Inline 3D metrology:
The process line has an inline AOI capable of inspecting solder paste deposits and component placement.

Digital photography and microphotography:
Microscope with maximum magnification of 122X equipped with a digital camera of 11.8Mpixel resolution.

3D laser profilometry:
3D profiling is particularly useful for measuring the contours of fragile or pliable material with sub micron resolution. Typical applications include measuring electronic components, stamped parts reflowed or deposited solder paste and chip attach adhesives.

Real time material flow visualization platforms:
This platform has a high-speed camera capable of visualizing the release of solder pastes from stencils during the printing process.

High speed imagery:
High speed camera used to visualize printing and dispensing processes.

Selective Laser soldering:
Currently used to investigate alternate thermal sealing and soldering solutions.

Rapid Prototyping:
Rapid generation of plastic models from CAD data.

Wafer Bump Metrology:
Bump height and diameter measurements for full wafers.