Defect : Bridging Process/machine infomation :  Board type - Double sided  Solderability protection - OSP  Flux carrier - Water  Preheat type - Forced Convection  Process solutions Conveyor speed too slow. a. Time over preheat too long causing flux to be burned off. b. Dwell time too long causing flux to be destroyed before exiting the wave. Topside board temp too low. Flux not active enough or solids percentage too low. Solder temperature too low. Use debridging knife to remove bridges. Not enough flux.   Board and design solutions Lead length too long. Lead length to pad size ratio incorrect. Component layout, orientation. Using solder thieves on inline connections will prevent bridging. Pad design/size.