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BridgeVision^®

The MPM BridgeVision^® system is a patented method of analyzing bridge defects on circuit boards in the post-print inspection process. This innovative system utilizes texture-based image acquisition algorithms and a digital camera system with telecentric lenses to support the accurate identification of paste deposit defects. Available for the Accela platform, this fast and efficient method of defect identification and analysis operates simultaneously with MPM's original contrast-based 2D paste inspection. The BridgeVision package prevents defective and borderline products from continuing through the assembly process to reduce scrap and rework costs.

Features

• Texture-based image acquisition technology eliminates false positive detections associated with contrast-based bridge detection systems
• Error alarms are driven by both spike penetration and % gap covered measurements
• Automatic initiation of stencil cleaning based on bridge measurements
• Digital camera supports highly accurate defect assessment
• Available on the Accela