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White Papers

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ACCEL
Defluxing of Eutectic and Lead-Free Assemblies in a Single Cleaning Process - Oct. 2006 Applied Research for Optimizing Process: Parameters for Cleaning Pb-Free Flux Residue - Feb. 2006
CAMALOT
Accuracy Improvements for the Dispensing Operation - Feb. 2006 Dispensing Technology Comparison - Jan. 2005
ELECTROVERT
Effect of Contact Time on Lead-Free Wave Soldering - 2008 Flux Collection and Self-Clean Technique in Reflow Applications - 2008 Reflow Process Control Monitoring, and Data Logging - 2007 Liquid Tin Corrosion and Lead Free Wave Soldering - 2007 Hybrid Drying Technology for In-line Aqueous Cleaning of Lead-Free Assemblies - 2007 Flux Application for Lead-Free Wave Soldering - 2007 Defluxing of Eutectic and Lead-Free Assemblies in a Single Cleaning Process - Aug. 2006 Applied Research for Optimizing Process: Parameters for Cleaning Pb-Free Flux Residue - Feb. 2006
MPM
Solder Paste Inspection Technologies: 2D-3D Correlation - 2008 Broadband Printing – A Paradigm - 2008 Investigating the 01005-Component Assembly Process Requirements - 2008 Process Development for 01005 Lead-Free Passive Assembly: Stencil Printing - 2007 Determining Area Ratio Rule for Type 4 and Type 5 Solder Paste - 2007 Bumping BGA's Using Solder Paste Printing Process for RFI Shields Packaging - Feb. 2006 Closed-Loop Process Control in the Solder Paste Printing Process - Feb. 2006 Surface-mount printer builder bases new machine on user input - Feb. 2006
Lead-Free
Defluxing of Eutectic and Lead-Free Assemblies in a Single Cleaning Process - Oct. 2006
Advanced Development
No white papers at this time.