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One viable method of assembling printed circuit boards includes the process of using adhesive to hold components on the boards during the wave soldering operation: Adhesive Deposition.
Speedline Technologies provides both of the industry's best-in-class equipment solutions for achieving high performance and cost effectiveness in this process.
Camalot liquid dispensing systems achieve unmatched speed, reliability, and accuracy in adhesive deposition applications involving low-density boards and/or production lines that produce boards at moderate to low volumes.
MPM's complete line of stencil printers provide a variety of highly flexible systems to enhance throughput, maximize yields, and reduce total cost of ownership in the production of high-density boards at moderate to high volumes.