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As the electronics industry continues to develop and move forward, reflow soldering is right in the mix. Improvements in reflow technology have allowed the industry to advance electronics assembly by miniaturizing packages, allowing for increased speed and power in electronic designs. Without the ability to effectively and efficiently form a solder joint in a surface mount package, many of today's designs would not have come to fruition. This demand for a repeatable solder process continues to be driven by electronics manufacturers for better, more advanced products.
Electrovert reflow ovens deliver improved technology and performance without compromising quality and price - while resolving customer needs in lead-free processing, chemical compatibility, energy reduction, flux management, and process control.
As high reliability SMT PCB's become more complex and process windows continue to decrease, manufacturers are looking for technologies that improve product reliability, reduce costs associated with rework or scrap, reduce operating costs, and still provide the levels of throughput from an in-line reflow oven. Electrovert solutions are ideal for high volume / high mix demanding production environments where process speed, control and repeatability are critical.