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Solder paste provides the interconnection between a component and the printed circuit board. This material is traditionally deposited with a stencil printer, but can also be deposited using dispensers.
Speedline provides the industry's best-in-class equipment solutions for achieving high performance and cost effectiveness in deposition.
MPM's complete line of stencil printers provide a variety of highly flexible systems to enhance throughput, maximize yields, and reduce total cost of ownership in the production of high-density boards at moderate to high volumes.
Camalot liquid dispensing systems achieve unmatched speed, reliability, and accuracy in solder paste deposition applications involving low-density boards and/or applications demanding quick-turn production since hard tooling is not rapid.