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Flip chip is the method of electrically connecting a die to a package carrier through a conductive "bump" that is placed directly on the die surface. The bumped die is then placed face down, directly connecting the bumps to pads on the carrier. A solder reflow process permanently attaches the bumped die and capillary underfill is dispensed between the die and the substrate to control stress and strain in the solder joints.
The miniature solder bumps used for flip-chip interconnections result in standoff distances in the range of 50 to 100 microns. Speedline provides the solutions and resources for manufacturers to meet their required standards for performance and dependability. Our unique expertise enables manufacturers to face the unique production and cleaning challenges created by these close dimensions.
Speedline's leading underfill, printing, dispensing, reflow soldering, and cleaning systems enable manufacturers to achieve faster, more efficient, and more cost effective solutions that meet flip chip application requirements.